The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2016

Filed:

Feb. 28, 2014
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Shinichi Hirano, Utsunomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01); G03F 9/00 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70783 (2013.01); G03F 7/707 (2013.01); G03F 9/7011 (2013.01);
Abstract

The present invention provides a substrate processing apparatus for performing a process of reducing warpage of a substrate, comprising a substrate stage configured to hold the substrate, a pressing member including a portion formed to press a peripheral portion of the substrate against the substrate stage, an obtaining unit configured to obtain information indicating a shift between a center of a region where a pattern is formed on the substrate and a center of the substrate, and a controller configured to control relative positions of the substrate stage and the pressing member based on the information obtained by the obtaining unit, such that the portion of the pressing member presses the peripheral portion of the substrate.


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