The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2016
Filed:
Jun. 29, 2012
Applicants:
Yuji Akiyama, Tokyo, JP;
Shoji Akiyama, Tokyo, JP;
Takeshi Yamasaki, Tokyo, JP;
Inventors:
Assignee:
Sony Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 1/00 (2006.01); B01L 3/02 (2006.01); G01N 21/01 (2006.01); B01L 3/00 (2006.01); G01N 15/14 (2006.01);
U.S. Cl.
CPC ...
G01N 1/00 (2013.01); B01L 3/0268 (2013.01); B01L 3/502776 (2013.01); G01N 15/1484 (2013.01); G01N 21/01 (2013.01); B01L 3/502707 (2013.01); B01L 2200/0652 (2013.01); B01L 2200/12 (2013.01); B01L 2300/0816 (2013.01); B01L 2300/0887 (2013.01); B01L 2400/0433 (2013.01); B01L 2400/0487 (2013.01); G01N 2015/149 (2013.01);
Abstract
There is provided a microchip including a flow channel, an ejection portion, and a cutout portion. The flow channel is configured to convey a fluid therein. The ejection portion includes an opening directed toward an end face of a substrate layer, and the ejection portion is configured to eject the fluid flowing through the flow channel to outside. The substrate layer is laminated to each other. The cutout portion is formed between the opening of the ejection portion and the end face of the substrate layer. The cutout portion has a larger diameter than that of the opening.