The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2016

Filed:

Jul. 26, 2012
Applicants:

Yoshihiro Yokota, Hyogo, JP;

Kenichi Inoue, Hyogo, JP;

Koji Inoue, Hyogo, JP;

Kyoji Zaitsu, Hyogo, JP;

Koichi Makii, Aichi, JP;

Inventors:

Yoshihiro Yokota, Hyogo, JP;

Kenichi Inoue, Hyogo, JP;

Koji Inoue, Hyogo, JP;

Kyoji Zaitsu, Hyogo, JP;

Koichi Makii, Aichi, JP;

Assignee:

Kobe Steel, Ltd., Hyogo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 21/08 (2006.01); H01L 23/36 (2006.01); H01L 23/373 (2006.01); B21C 23/00 (2006.01); B23P 15/26 (2006.01); B21C 23/22 (2006.01);
U.S. Cl.
CPC ...
F28F 21/08 (2013.01); B21C 23/002 (2013.01); B21C 23/007 (2013.01); B21C 23/22 (2013.01); B23P 15/26 (2013.01); H01L 23/36 (2013.01); H01L 23/3735 (2013.01); H01L 23/3736 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13033 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); Y10T 29/49826 (2015.01);
Abstract

This heat sink has bonded on one surface a member to be bonded, and has a cooling member in contact with the other surface. The heat sink is provided with a metal plate having a thermal expansion coefficient larger than that of the member to be bonded, and the metal plate is provided with a center portion where the member to be bonded is bonded, and a plurality of linear peripheral slits formed in a whirl-like radial manner such that the linear peripheral slits surround the center portion.


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