The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2016

Filed:

Sep. 01, 2012
Applicant:

Gabe Cherian, Sun Valley, ID (US);

Inventor:

Gabe Cherian, Sun Valley, ID (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/373 (2006.01); F28F 3/00 (2006.01); F28F 3/02 (2006.01); F28D 15/02 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
F28F 3/00 (2013.01); F28D 15/0275 (2013.01); F28F 3/02 (2013.01); F28F 3/022 (2013.01); H01L 23/367 (2013.01); H01L 23/427 (2013.01); F28F 2255/02 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/15311 (2013.01);
Abstract

New heat spreaders are proposed to connect high power, high heat generating electronic devices to their downstream heat dissipating cooling components. First, the spreaders distribute the high heat flux over a wider surface area, thus reducing the flux to levels more easily handled by the downstream cooling system. Second, the spreaders incorporate flexible columns or elements to join the electronic devices to the main body of the spreader, so as to negate the undesirable effects of CTE mismatch. Columns with a higher standoff distance between the components are more flexible than a direct flat interface attachment between the heat source and the heat sink, and will have less chance of delaminating. Several embodiments are proposed and can be used in appropriate situations. The heat spreaders can be helpful in harsh environments and in high heat generating applications, such as spacecraft, satellites, as well as land locked high power computer systems.


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