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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9458982 B1

PDFFull Text
Date of Patent:
Oct. 04, 2016

Filed:

Sep. 15, 2014

Light emitting device

Applicant:

Rohm Co., Ltd., Kyoto-shi, Kyoto, JP;

Inventors:

Yuki Tanuma, Kyoto, JP;

Tomoharu Horio, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:

Hamre, Schumann, Mueller & Larson, P.C.

Primary Examiner:

Anh Mai

Assistant Examiner:

Glenn Zimmerman

Int. Cl.
CPC ...
F21V 3/00 (2015.01); F21V 5/00 (2015.01); F21V 5/04 (2006.01); H01L 33/48 (2010.01); H05B 33/02 (2006.01); H01L 23/00 (2006.01); H01L 33/58 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); F21Y 101/02 (2006.01); F21Y 105/00 (2016.01);
U.S. Cl.
CPC ...
F21V 5/04 (2013.01); H01L 24/97 (2013.01); H01L 33/486 (2013.01); H05B 33/02 (2013.01); F21Y 2101/02 (2013.01); F21Y 2105/00 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48465 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A light emitting device includes a light emitting element, a wire, and a substrate. The substrate is formed with a first recess and a second recess that are open in a common surface of the substrate. The first recess includes a first bottom surface and a first side surface connected to the first bottom surface. The light emitting element is disposed on the first bottom surface. The second recess includes a second bottom surface and a second side surface connected to the second bottom surface. The wire is bonded to the second bottom surface. Both of the first side surface and the second side surface reach the common surface. The first side surface is connected to both of the second bottom surface and the second side surface. The opening area of the first recess is larger than the opening area of the second recess.

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