The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2016

Filed:

Sep. 30, 2011
Applicants:

Stefan Hirsch, Stuttgart, DE;

Achim Wiebelt, Deidesheim, DE;

Caroline Schmid, Stuttgart, DE;

Tobias Isermeyer, Loewenstein, DE;

Marc-thomas Eisele, München, DE;

Inventors:

Stefan Hirsch, Stuttgart, DE;

Achim Wiebelt, Deidesheim, DE;

Caroline Schmid, Stuttgart, DE;

Tobias Isermeyer, Loewenstein, DE;

Marc-Thomas Eisele, München, DE;

Assignee:

MAHLE International GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 10/6554 (2014.01); B60K 1/04 (2006.01); B60L 11/18 (2006.01); H01M 10/04 (2006.01); H01M 10/647 (2014.01); H01M 10/6556 (2014.01); H01M 10/652 (2014.01); H01M 10/613 (2014.01); B60K 1/00 (2006.01); H01M 10/625 (2014.01);
U.S. Cl.
CPC ...
B60K 1/04 (2013.01); B60L 11/1874 (2013.01); H01M 10/0413 (2013.01); H01M 10/613 (2015.04); H01M 10/647 (2015.04); H01M 10/652 (2015.04); H01M 10/6554 (2015.04); H01M 10/6556 (2015.04); B60K 2001/005 (2013.01); H01M 10/625 (2015.04); Y02T 10/7005 (2013.01); Y02T 10/705 (2013.01);
Abstract

A device for thermal connection of an energy store to a cooling plate and/or a contact element, and a cooling plate on a contact element and/or a fluid is provided. The device for thermal connection has a first region having a first heat transfer property and at least one other region having another heat transfer property, wherein the first region and the at least one other region are arranged next to one another in relation to the heat transfer surface.


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