The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2016
Filed:
Jun. 11, 2015
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Rajeev Bajaj, Fremont, CA (US);
Barry Lee Chin, Saratoga, CA (US);
Terrance Y. Lee, Oakland, CA (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 67/00 (2006.01); B24B 37/26 (2012.01); B24D 18/00 (2006.01); B33Y 80/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B29K 75/00 (2006.01); B29K 509/02 (2006.01);
U.S. Cl.
CPC ...
B29C 67/0088 (2013.01); B24B 37/26 (2013.01); B24D 18/00 (2013.01); B29C 67/007 (2013.01); B29C 67/0062 (2013.01); B33Y 80/00 (2014.12); B29C 67/0059 (2013.01); B29C 67/0081 (2013.01); B29K 2075/00 (2013.01); B29K 2509/02 (2013.01); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12);
Abstract
A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a pad material precursor from a nozzle and solidifying the pad material precursor to form a solidified pad material.