The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2016

Filed:

Nov. 05, 2012
Applicant:

Delphi Technologies, Inc., Troy, MI (US);

Inventors:

Chris R. Snider, Noblesville, IN (US);

Mark A. Jackson, Kokomo, IN (US);

Assignee:

Delphi Technologies, Inc., Troy, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 9/00 (2006.01); H04B 1/08 (2006.01); H05K 1/02 (2006.01); H05K 5/02 (2006.01); H05K 13/00 (2006.01); H04R 1/02 (2006.01); B29C 59/16 (2006.01); G06F 11/00 (2006.01); B60R 11/02 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0007 (2013.01); B29C 59/16 (2013.01); B60R 11/02 (2013.01); G06F 11/00 (2013.01); H04B 1/082 (2013.01); H04R 1/02 (2013.01); H05K 1/0215 (2013.01); H05K 5/0217 (2013.01); H05K 5/0221 (2013.01); H05K 5/0226 (2013.01); H05K 7/20409 (2013.01); H05K 7/20418 (2013.01); H05K 7/20436 (2013.01); H05K 9/0047 (2013.01); H05K 9/0079 (2013.01); H05K 9/0081 (2013.01); H05K 13/00 (2013.01); H05K 1/141 (2013.01); H05K 2201/09081 (2013.01); H05K 2201/10386 (2013.01); H05K 2201/10446 (2013.01); Y10T 16/547 (2015.01); Y10T 16/5476 (2015.01); Y10T 29/49002 (2015.01); Y10T 29/4913 (2015.01); Y10T 29/4957 (2015.01); Y10T 29/49124 (2015.01); Y10T 29/49126 (2015.01); Y10T 29/49128 (2015.01); Y10T 29/49169 (2015.01); Y10T 29/49172 (2015.01); Y10T 29/49826 (2015.01); Y10T 29/49861 (2015.01); Y10T 29/5313 (2015.01); Y10T 74/20396 (2015.01); Y10T 403/70 (2015.01); Y10T 403/77 (2015.01); Y10T 428/24289 (2015.01);
Abstract

A lightweight audio player for vehicular application is virtually 'fastenerless' and includes a fold-up case formed of polymer based material molded to provide details to accept audio devices, as well as the circuit boards required for electrical control and display. The case is of composite structure, including an insert molded electrically conductive wire mesh screen. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. Side wall closure members define self-engaging attachment features for affixing to the case, providing electrical self-grounding with the wire screen and thermal grounding with internal power devices. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment.


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