The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2016

Filed:

May. 10, 2013
Applicant:

Nec Corporation, Tokyo, JP;

Inventors:

Arihiro Matsunaga, Tokyo, JP;

Minoru Yoshikawa, Tokyo, JP;

Hitoshi Sakamoto, Tokyo, JP;

Akira Shoujiguchi, Tokyo, JP;

Masaki Chiba, Tokyo, JP;

Kenichi Inaba, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); B23P 15/26 (2006.01); H01L 23/427 (2006.01); F28D 15/02 (2006.01); G06F 1/20 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20336 (2013.01); B23P 15/26 (2013.01); F28D 15/0266 (2013.01); F28D 15/0275 (2013.01); H01L 23/427 (2013.01); H05K 7/2039 (2013.01); H05K 7/20309 (2013.01); H05K 7/20318 (2013.01); F28F 2275/08 (2013.01); H01L 23/4006 (2013.01); H01L 2023/4062 (2013.01); H01L 2924/0002 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/53174 (2015.01);
Abstract

It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening.


Find Patent Forward Citations

Loading…