The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2016
Filed:
Mar. 13, 2014
Applicant:
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Inventors:
Tadashi Nomura, Kyoto-fu, JP;
Akihiko Kamada, Kyoto-fu, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto-Fu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/28 (2006.01); H05K 1/03 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 3/284 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19105 (2013.01); H05K 1/0306 (2013.01); H05K 1/144 (2013.01); H05K 2201/096 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09154 (2013.01); H05K 2201/09163 (2013.01); H05K 2201/09845 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/2018 (2013.01); H05K 2201/2072 (2013.01); H05K 2203/063 (2013.01); H05K 2203/1327 (2013.01); Y10T 29/49146 (2015.01);
Abstract
An engagement structure for preventing the separation of a resin layer is formed in a contact surface of an insulating substrate in a connecting component, the contact surface being in contact with the resin layer. The resin layer engages with the engagement structure in the contact surface in the insulating substrate in contact with the resin layer, the contact surface forming the side surface of the connecting component.