The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2016
Filed:
Dec. 17, 2010
Applicants:
Thomas Gottwald, Dunningen-Seedorf, DE;
Alexander Neumann, Rottweil, DE;
Inventors:
Thomas Gottwald, Dunningen-Seedorf, DE;
Alexander Neumann, Rottweil, DE;
Assignee:
SCHWEIZER ELECTRONIC AG, Schramberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 1/18 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H05K 3/20 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/186 (2013.01); H01L 21/486 (2013.01); H01L 21/4846 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3107 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 23/5389 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68304 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2101 (2013.01); H01L 2224/211 (2013.01); H01L 2224/214 (2013.01); H01L 2224/221 (2013.01); H01L 2224/2201 (2013.01); H01L 2224/224 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/9202 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01044 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01061 (2013.01); H01L 2924/01068 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01087 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/12042 (2013.01); H05K 1/189 (2013.01); H05K 3/205 (2013.01); H05K 3/429 (2013.01); H05K 3/462 (2013.01); H05K 3/4602 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/0367 (2013.01); H05K 2203/063 (2013.01); H05K 2203/1469 (2013.01);
Abstract
The present invention relates to a method for producing a conductor structural element, comprising providing a rigid substrate, electrodepositing a copper coating on the rigid substrate, applying a conductor pattern structure to the copper coating, then possibly mounting components, laminating the substrate with at least one electrically insulating layer, detaching the rigid substrate, at least partially removing the remaining copper coating of the rigid substrate in such a way that the conductor pattern structure is exposed.