The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2016

Filed:

Aug. 30, 2014
Applicant:

Skyworks Solutions, Inc., Wobrun, MA (US);

Inventors:

Ambarish Roy, Waltham, MA (US);

Stephen Richard Moreschi, Peabody, MA (US);

Assignee:

Other;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H04B 1/16 (2006.01); H04B 1/04 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0251 (2013.01); H04B 1/16 (2013.01); H05K 1/0243 (2013.01); H05K 1/113 (2013.01); H05K 1/181 (2013.01); H04B 2001/0408 (2013.01);
Abstract

Improved signal path in radio-frequency (RF) module having laminate substrate. In some embodiments, a laminate substrate for mounting RF components can include N conductor pads positioned at different layers of the laminate substrate. Such conductor pads can include an input pad, an output pad, and at least one intermediate pad between the input and output pads. The laminate substrate can further include a connection feature formed between each neighboring pair among the N conducting pads to provide a signal path between the input pad and the output pad. First and second connection features associated with each of the at least one intermediate pad can be positioned near opposite ends of the intermediate pad to thereby reduce parasitic effects associated with the N conductor pads. Examples of methods and devices related to such laminate substrate are disclosed.


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