The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2016

Filed:

Sep. 07, 2011
Applicants:

Thomas Hennecke, Leinfelden, DE;

Michael Heim, Holzgerlingen, DE;

Hans Irion, Herrenberg, DE;

Gerhard Braun, Rottenburg, DE;

Frank Wehrmann, Reutlingen, DE;

Georg Voegele, Langenargen, DE;

Sigmund Braun, Kusterdingen, DE;

Johannes Hirschle, Mehrstetten, DE;

Alexander Fink, Stuttgart, DE;

Inventors:

Thomas Hennecke, Leinfelden, DE;

Michael Heim, Holzgerlingen, DE;

Hans Irion, Herrenberg, DE;

Gerhard Braun, Rottenburg, DE;

Frank Wehrmann, Reutlingen, DE;

Georg Voegele, Langenargen, DE;

Sigmund Braun, Kusterdingen, DE;

Johannes Hirschle, Mehrstetten, DE;

Alexander Fink, Stuttgart, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02K 5/18 (2006.01); H02K 9/22 (2006.01); H02K 5/04 (2006.01);
U.S. Cl.
CPC ...
H02K 9/22 (2013.01); H02K 5/18 (2013.01); H02K 11/33 (2016.01); H02K 5/04 (2013.01);
Abstract

The invention relates to an electric motor, in particular an electronically commutated electric motor. The electric motor has a stator, a rotor and a housing, which accommodates at least the stator and the rotor in a cavity. The electric motor also has a power output stage, which is connected to the stator and is designed to energize the stator in order to induce a rotating magnetic field. The power output stage has at least one power semiconductor with a thermal contact area, wherein the thermal contact area is thermally conductively connected to the housing, with the result that heat generated in the power semiconductor can be dissipated to the housing. According to the invention, the housing has a housing cup, which at least partially surrounds the cavity and is preferably thermally conductive and which has a cup wall, wherein the cup wall has a mating contact area corresponding to the thermal contact area.


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