The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2016
Filed:
Jul. 01, 2013
Applicant:
Nichia Corporation, Anan-shi, Tokushima, JP;
Inventors:
Kunihito Sugimoto, Anan, JP;
Keisuke Sejiki, Tokushima, JP;
Assignee:
NICHIA CORPORATION, Anan-Shi, Tokushima, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/64 (2010.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01); H01L 21/56 (2006.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/54 (2013.01); H01L 21/565 (2013.01); H01L 33/62 (2013.01); H01L 33/641 (2013.01); H01L 33/486 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01);
Abstract
A molded package, comprising: a molded resin having a recess for accommodating a light emitting element; a ceramic substrate disposed in a bottom of the recess, the ceramic substrate having one surface exposed from the bottom of the recess and the other surface exposed from a rear surface of the molded resin; and a lead disposed at a lower part of the molded resin, the light emitting element being mounted on the one surface of the ceramic substrate, the lead being in contact with at least one side surface of the ceramic substrate to hold the ceramic substrate.