The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2016

Filed:

Dec. 22, 2015
Applicant:

Selex Galileo Limited, Basildon, Essex, GB;

Inventors:

Christopher Jones, Basildon, GB;

Sudesh Bains, Basildon, GB;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/103 (2006.01); H01L 27/146 (2006.01); H01L 31/18 (2006.01); H01L 31/0296 (2006.01);
U.S. Cl.
CPC ...
H01L 31/1832 (2013.01); H01L 27/1465 (2013.01); H01L 27/14649 (2013.01); H01L 27/14689 (2013.01); H01L 31/0296 (2013.01); H01L 31/1032 (2013.01);
Abstract

A method of forming infra red detector arrays is described, starting with the manufacture of a wafer. The wafer is formed from a GaAs or GaAs/Si substrate having CMT deposited thereon by MOVPE. The CMT deposited comprises a number of layers of differing composition, the composition being controlled during the MOVPE process and being dependent on the thickness of the layer deposited. Other layers are positioned between the active CMT layers and the substrate. A CdTe buffer layer aids the deposition of the CMT on the substrate and an etch stop layer is also provided. Once the wafer is formed, the buffer layer, the etch stop layer and all intervening layers are etched away leaving a wafer suitable for further processing into an infra red detector.


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