The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2016

Filed:

Feb. 17, 2016
Applicant:

Pfc Device Holdings Limited, Hong Kong, HK;

Inventors:

Kuan-Yu Chen, New Taipei, TW;

Mei-Ling Chen, New Taipei, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/332 (2006.01); H01L 29/66 (2006.01); H01L 29/06 (2006.01); H01L 21/02 (2006.01); H01L 21/308 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66333 (2013.01); H01L 21/02274 (2013.01); H01L 21/3086 (2013.01); H01L 29/0615 (2013.01);
Abstract

A low-temperature oxide method is used for manufacturing backside field stop layer of IGBT and first fabricates front elements and front metal layer on a first face of a first conductive type substrate. A multiple-recesses structure is formed on a back side of the first conductive type substrate. Each of the recess in the multiple-recesses structure has first conductive type implanted patterns on exterior sides thereof and the multiple-recesses structure has a first conductive type implanted layer on bottom thereof. A plurality of first conductive type polysilicon layers are deposited into the multiple-recesses structure and respectively corresponding to the first conductive type implanted patterns. A second conductive type impurity layer is formed on the bottom of the first conductive type substrate and laser annealing is conducted to form backside field stop layer for IGBT.


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