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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9455283 B1

PDFFull Text
Expired
Date of Patent:
Sep. 27, 2016

Filed:

Mar. 03, 2015

Etch chemistries for metallization in electronic devices

Applicants:

Patrick Hogan, Somerville, MA (US);

John Moore, Camarillo, CA (US);

Alex Brewer, Camarillo, CA (US);

Jared Pettit, Camarillo, CA (US);

Inventors:

Patrick Hogan, Somerville, MA (US);

John Moore, Camarillo, CA (US);

Alex Brewer, Camarillo, CA (US);

Jared Pettit, Camarillo, CA (US);

Assignees:

H.C. Starck, Inc., Newton, MA (US);

Daetec, LLC, Camarillo, CA (US);

Attorney:

Morgan, Lewis & Bockius LLP

Primary Examiner:

Daniel Whalen

Int. Cl.
CPC ...
C23F 1/16 (2006.01); H01L 21/3205 (2006.01); H01L 27/12 (2006.01); C23F 1/02 (2006.01); H01L 29/66 (2006.01); H01L 21/283 (2006.01); H01L 29/49 (2006.01); H01L 29/423 (2006.01); H01L 29/786 (2006.01); H01L 21/3213 (2006.01); C23F 1/18 (2006.01); C23F 1/26 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1288 (2013.01); C23F 1/02 (2013.01); C23F 1/16 (2013.01); C23F 1/18 (2013.01); C23F 1/26 (2013.01); H01L 21/283 (2013.01); H01L 21/32134 (2013.01); H01L 27/1218 (2013.01); H01L 27/1296 (2013.01); H01L 29/42384 (2013.01); H01L 29/4908 (2013.01); H01L 29/4958 (2013.01); H01L 29/66742 (2013.01); H01L 29/78603 (2013.01);
Abstract

In various embodiments, etchants featuring (i) mixtures of hydrochloric acid, methanesulfonic acid, and nitric acid, or (ii) mixtures of phosphoric acid, methanesulfonic acid, and nitric acid, are utilized to etch metallic bilayers while minimizing resulting etch discontinuities between the layers of the bilayer.

Find Patent Forward Citations

Hogan, Patrick. (2016). Etch chemistries for metallization in electronic devices (U.S. Patent No. 9455283). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9455283

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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