The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2016
Filed:
Dec. 12, 2013
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
MuSeob Shin, Chungcheongnam-do, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-Si, Gyeonggi-Do, KR;
Abstract
A semiconductor package includes a package substrate. A first semiconductor chip is mounted on the package substrate. The first semiconductor chip includes a first chip region and first chip pads formed on a top surface of the first chip region. A second semiconductor chip is mounted on the package substrate. The second semiconductor chip includes a second chip region and second chip pads formed on a top surface of the second chip region. A boundary region having a groove divides the first chip region and the second chip region. The first chip region, the second chip region and the boundary region share a semiconductor substrate of a one-body type.