The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2016
Filed:
Sep. 04, 2015
Applicant:
Anokiwave, Inc., San Diego, CA (US);
Inventors:
Vipul Jain, Irvine, CA (US);
Noyan Kinayman, Harvard, MA (US);
Amir Esmaili, San Diego, CA (US);
Guarav Menon, San Marcos, CA (US);
Nitin Jain, San Diego, CA (US);
Assignee:
Anokiwave, Inc., San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/552 (2006.01); H01L 23/495 (2006.01); H01L 23/66 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/481 (2013.01); H01L 21/4825 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/4952 (2013.01); H01L 23/49503 (2013.01); H01L 23/49562 (2013.01); H01L 23/49838 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/06 (2013.01); H01L 24/42 (2013.01); H01L 24/46 (2013.01);
Abstract
A packaged IC has a package with a die paddle, a signal lead, and a ground lead. The packaged IC also has a die, secured to the package, with a ground pad and a signal pad. The signal pad is electrically connected to the signal lead, and the ground pad is electrically connected to both the die paddle and the ground lead.