The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2016

Filed:

Sep. 20, 2013
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Sung Sik Shin, Busan, KR;

Myung Jin Han, Busan, KR;

Ji Sook Choi, Busan, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-Si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/00 (2006.01); H01F 41/00 (2006.01); H01F 17/00 (2006.01); H01F 41/04 (2006.01); H01F 27/29 (2006.01);
U.S. Cl.
CPC ...
H01F 27/00 (2013.01); H01F 17/0033 (2013.01); H01F 41/00 (2013.01); H01F 41/046 (2013.01); H01F 27/292 (2013.01);
Abstract

Disclosed herein are a multilayered power inductor including a magnetic layer, an inner electrode layer, and an outer electrode layer, wherein a pore ratio at a section of the inner electrode layer is 7% or less and a method for preparing the same. According to the exemplary embodiments of the present invention, the number of pores in the inner electrode layer of the multilayered power inductor can be minimized and the residual carbon can be removed by the sintering delay of the inner electrode to increase the densification of the inner electrode layer after being sintered, thereby improving the RDC characteristics of the multilayered power inductor. Therefore, the multilayered power inductor including the inner electrode layer according to the exemplary embodiments of the present invention can implement the high capacity and the low RDC, thereby providing the small, thin, and multi-functional chip components.


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