The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2016

Filed:

Mar. 28, 2013
Applicant:

Ngk Spark Plug Co., Ltd., Nagoya-shi, Aichi, JP;

Inventors:

Yuri Saito, Komaki, JP;

Daisuke Uematsu, Ichinomiya, JP;

Nobuhiro Hayakawa, Chita, JP;

Ryouma Nakayama, Komaki, JP;

Kentarou Mori, Inuyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/02 (2006.01); H01B 13/00 (2006.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01); H01B 1/02 (2006.01); H01B 13/30 (2006.01); H01B 1/22 (2006.01); B29C 67/00 (2006.01);
U.S. Cl.
CPC ...
H01B 13/0026 (2013.01); H01B 1/02 (2013.01); H01B 1/22 (2013.01); H01B 13/30 (2013.01); H05K 1/092 (2013.01); H05K 3/125 (2013.01); H05K 3/1283 (2013.01); B29C 67/0059 (2013.01); Y10T 428/24909 (2015.01);
Abstract

A pattern forming method which includes ejecting, through a nozzle, a liquid material containing a solvent and metal particles, and depositing droplets of the liquid material onto a pattern formation object, to thereby form a pattern thereon, wherein the viscosity of the liquid material before ejection thereof through the nozzle is lower than that of the liquid material at the time of deposition of droplets thereof onto the pattern formation object.


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