The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2016

Filed:

Nov. 18, 2013
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Guy Cote, San Jose, CA (US);

Joseph P. Bratt, San Jose, CA (US);

Nitin Bhargava, San Jose, CA (US);

Hao Chen, San Ramon, CA (US);

Joseph J. Cheng, Palo Alto, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 3/00 (2006.01); G06F 13/00 (2006.01); G06F 9/44 (2006.01); G06F 3/06 (2006.01); G06F 9/445 (2006.01);
U.S. Cl.
CPC ...
G06F 9/4401 (2013.01); G06F 3/0629 (2013.01); G06F 8/71 (2013.01); G06F 9/445 (2013.01);
Abstract

Methods and apparatus for configuring multiple components of a subsystem are described. The configuration memory of each of a plurality of components coupled to an interconnect includes a global configuration portion. The configuration memory of one of the components may be designated as a master global configuration for all of the components. A module coupled to the interconnect may receive writes to the components from a configuration source. For each write, the module may decode the write to determine addressing information and check to see if the write is addressed to the master global configuration. If the write is addressed to the master global configuration, the module broadcasts the write to the global configuration portion of each of the components via the interconnect. If the write is not addressed to the master global configuration, the module forwards the write to the appropriate component via the interconnect.


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