The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2016

Filed:

Feb. 27, 2014
Applicant:

Google Inc., Mountain View, CA (US);

Inventors:

James Tanner, Los Gatos, CA (US);

William Riis Hamburgen, Los Altos, CA (US);

Assignee:

Google Inc., Mountain View, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/20 (2006.01); F28F 1/40 (2006.01); F28F 19/00 (2006.01); F28F 1/10 (2006.01); H01L 23/467 (2006.01); F28D 15/02 (2006.01); F28D 1/02 (2006.01); H01L 23/367 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
G06F 1/203 (2013.01); F28F 1/10 (2013.01); F28F 1/40 (2013.01); F28F 19/00 (2013.01); G06F 1/20 (2013.01); H01L 23/467 (2013.01); F28D 1/024 (2013.01); F28D 15/0275 (2013.01); H01L 23/3672 (2013.01); H01L 23/427 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Aspects of the disclosure relate generally to active cooling or removing heat generated by a processor in a computing device. More specifically, a cooling system in a computing device may include a heatpipe which moves heat along a fin pack. The fin pack may include top and bottom ends as well as a plurality of fins. The fins may extend only a portion of the way between the ends thus creating an air duct. The air duct may allow debris to move along an edge of the fin and out of the computing device. The fins may also be curved to promote the forcing of debris through the fin pack while still allowing the heat to be expelled through the fins.


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