The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2016

Filed:

Jan. 05, 2015
Applicant:

The Trustees of Columbia University IN the City of New York, New York, NY (US);

Inventors:

Gregory T. Carroll, New York, NY (US);

Jeffrey T. Koberstein, Storrs, CT (US);

Denong Wang, Palo Alto, CA (US);

Nicholas J. Turro, Tenafly, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C07D 209/48 (2006.01); C07C 69/76 (2006.01); G03F 7/004 (2006.01); G03F 7/20 (2006.01); B05D 3/06 (2006.01); B05D 5/00 (2006.01); B05D 7/02 (2006.01); B05D 7/14 (2006.01); C23C 18/16 (2006.01); C23C 18/30 (2006.01); C23C 18/32 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0045 (2013.01); B05D 3/06 (2013.01); B05D 3/067 (2013.01); B05D 5/00 (2013.01); B05D 7/02 (2013.01); B05D 7/14 (2013.01); G03F 7/20 (2013.01); C23C 18/1612 (2013.01); C23C 18/1641 (2013.01); C23C 18/30 (2013.01); C23C 18/32 (2013.01);
Abstract

Compounds and methods for controlling the surface properties are described. Compounds of the invention can form radicals upon exposure to irradiation, which can then react with nearby molecules to alter the surface properties of various substrates. The invention can provide surfaces that are resistant to dewetting, surfaces that have immobilized molecules such as carbohydrates and polymers immobilized, and surfaces that have metals deposited on the surface. The invention can be utilized in a wide range of application, such as sensors, microreactors, microarrays, electroless deposition of metals, and the like.


Find Patent Forward Citations

Loading…