The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2016

Filed:

May. 01, 2015
Applicant:

David R. Hall, Provo, UT (US);

Inventors:

David R. Hall, Provo, UT (US);

Benjamin J. Jensen, Orem, UT (US);

Clayton Kimball, Holiday, UT (US);

Daniel P. Nelson, Alpine, UT (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B44F 7/00 (2006.01); B44F 9/00 (2006.01); E04C 1/00 (2006.01); E04F 13/08 (2006.01); E04F 13/075 (2006.01); E04B 1/76 (2006.01);
U.S. Cl.
CPC ...
E04F 13/0875 (2013.01); E04B 1/762 (2013.01); E04B 1/7625 (2013.01); E04F 13/075 (2013.01); E04F 13/0866 (2013.01); E04F 13/0871 (2013.01); E04F 2203/02 (2013.01); E04F 2290/00 (2013.01);
Abstract

A method for insulating and imparting a desired architectural style to a building or other structure is disclosed. In one embodiment, such a method includes providing a facade comprising an insulating panel and a decorative layer coupled to a front side of the insulating panel. The facade has a substantially planar surface on a back side thereof. The front side of the facade may be non-planar to provide a desired architectural contour to the facade. The method further provides an attachment mechanism on at least one of: (1) the back side of the facade, and (2) an exposed face of a building or other structure. The method attaches the back side of the facade to the exposed face of the building or other structure using the attachment mechanism. A corresponding apparatus and overall assembly are also disclosed herein.


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