The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2016

Filed:

Feb. 08, 2013
Applicant:

Omron Corporation, Kyoto, JP;

Inventors:

Koichi Takemura, Shiga, JP;

Tomofusa Shibata, Kyoto, JP;

Yoshihisa Yamanaka, Shiga, JP;

Kenji Suzuki, Saitama, JP;

Kazutaka Kaneko, Saitama, JP;

Yoshikaga Taguchi, Shiga, JP;

Masayuki Kojima, Shiga, JP;

Assignee:

OMRON Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 33/00 (2006.01); B29D 11/00 (2006.01); B29C 59/02 (2006.01); B29C 35/16 (2006.01);
U.S. Cl.
CPC ...
B29D 11/00663 (2013.01); B29C 35/16 (2013.01); B29C 59/02 (2013.01); B29C 2035/1616 (2013.01); B29C 2035/1658 (2013.01);
Abstract

A transfer molding method has a transfer molding step of performing transfer molding to a resin sheet between a first die and a second die, which are disposed while facing each other, by heating at least one of the first and second dies, and a cooling step of cooling the resin sheet. The cooling step includes a first cooling step of cooling the resin sheet while an applied pressure is maintained at a first setting value smaller than a value of an applied pressure in the transfer molding step, and a second cooling step of cooling the resin sheet while the applied pressure is reduced to a second setting value smaller than the first setting value.


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