The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2016

Filed:

Mar. 04, 2013
Applicant:

Omron Corporation, Kyoto-Shi, JP;

Inventors:

Ryo Toyota, Nagaokakyo, JP;

Kyoji Kitamura, Uji, JP;

Koji Yamamoto, Takatsuki, JP;

Tomoyuki Nishida, Takatsuki, JP;

Assignee:

OMRON CORPORATION, Kyoto, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); B29C 45/14 (2006.01); B29C 45/00 (2006.01); B29K 705/00 (2006.01); B29K 101/12 (2006.01); B29K 509/00 (2006.01); B29K 105/16 (2006.01); C08K 3/36 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14311 (2013.01); B29C 45/14639 (2013.01); B29C 45/14778 (2013.01); B29C 45/0013 (2013.01); B29K 2101/12 (2013.01); B29K 2105/16 (2013.01); B29K 2509/00 (2013.01); B29K 2705/00 (2013.01); B29K 2995/0041 (2013.01); C08K 3/36 (2013.01); C08K 2201/016 (2013.01); Y10T 428/31678 (2015.04);
Abstract

A metal insert-molded article having sealing ability, a method for producing the same, and an electronic component having the metal insert-molded article, the metal insert-molded article comprising: a molding material and a metal material integrally molded together by insert molding, wherein the molding material comprises a crystalline thermoplastic resin as a main component, and comprises an inorganic filler in an amount inclusive of 0% by weight to 15% by weight, and the metal material has an aspect ratio inclusive of 1 to 10 in a cross section perpendicular to a lengthwise dimension of the metal insert-molded article, and is not surface treated for adhesion with the molding material.


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