The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2016
Filed:
Oct. 04, 2013
Applicant:
Sharp Kabushiki Kaisha, Osaka-shi, Osaka, JP;
Inventors:
Takahiro Nakahashi, Osaka, JP;
Hiroyuki Hanato, Osaka, JP;
Assignee:
SHARP KABUSHIKI KAISHA, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 43/58 (2006.01); B29C 43/02 (2006.01); B29C 43/00 (2006.01); B29C 35/02 (2006.01); B29C 37/00 (2006.01); B29L 11/00 (2006.01);
U.S. Cl.
CPC ...
B29C 43/58 (2013.01); B29C 35/02 (2013.01); B29C 35/0288 (2013.01); B29C 37/0003 (2013.01); B29C 43/003 (2013.01); B29C 43/021 (2013.01); B29C 2043/025 (2013.01); B29C 2043/5808 (2013.01); B29C 2043/5816 (2013.01); B29L 2011/0016 (2013.01);
Abstract
A molded product manufacturing method and a molded product manufacturing apparatus are realized, each of which has improved quality and productivity of a molded product. A pressure to be applied to an upper mold (ML) and a lower mold (ML) is reduced in stages during a process from a start of decrease in internal temperatures of the upper mold (ML) and the lower mold (ML) to a complete mold-release of a resin component (W). This prevents an excessive load from being applied to the resin component (W) which has been molded but has not been mold-released.