The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2016

Filed:

Oct. 24, 2005
Applicants:

Anna Lee Tonkovich, Marysville, OH (US);

Gary Roberts, West Richland, WA (US);

Sean P. Fitzgerald, Columbus, OH (US);

Timothy M. Werner, Traverse City, MI (US);

Matthew B. Schmidt, Columbus, OH (US);

Robert J. Luzenski, Marysville, OH (US);

G. Bradley Chadwell, Reynoldsburg, OH (US);

James A. Mathias, Columbus, OH (US);

Abhishek Gupta, Dublin, OH (US);

David J. Kuhlmann, Powell, OH (US);

Thomas D. Yuschak, Dublin, OH (US);

Inventors:

Anna Lee Tonkovich, Marysville, OH (US);

Gary Roberts, West Richland, WA (US);

Sean P. Fitzgerald, Columbus, OH (US);

Timothy M. Werner, Traverse City, MI (US);

Matthew B. Schmidt, Columbus, OH (US);

Robert J. Luzenski, Marysville, OH (US);

G. Bradley Chadwell, Reynoldsburg, OH (US);

James A. Mathias, Columbus, OH (US);

Abhishek Gupta, Dublin, OH (US);

David J. Kuhlmann, Powell, OH (US);

Thomas D. Yuschak, Dublin, OH (US);

Assignee:

Velocys, Inc., Plain City, OH (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B21D 39/00 (2006.01); B23K 31/02 (2006.01); B01J 19/00 (2006.01); B01F 5/06 (2006.01); B01F 13/00 (2006.01); B23K 20/02 (2006.01); F28D 9/00 (2006.01); F28F 3/04 (2006.01); F28F 13/06 (2006.01);
U.S. Cl.
CPC ...
B01J 19/0093 (2013.01); B01F 5/061 (2013.01); B01F 13/0059 (2013.01); B23K 20/023 (2013.01); B23K 31/02 (2013.01); F28D 9/0062 (2013.01); F28F 3/048 (2013.01); F28F 13/06 (2013.01); B01J 2219/00783 (2013.01); B01J 2219/00835 (2013.01); B01J 2219/00873 (2013.01); F28F 2260/02 (2013.01);
Abstract

Novel methods of making laminated, microchannel devices are described. Examples include: assembly from thin strips rather than sheets; and hot isostatic pressing (HIPing) to form devices with a hermetically sealed wall. Laminated microchannel articles having novel features are also described. The invention includes processes conducted using any of the articles described.


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