The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2016

Filed:

Aug. 29, 2013
Applicant:

Abb Technology Ag, Zurich, CH;

Inventors:

Shamsi Ismayilov, Conshohocken, PA (US);

Yaser A. Khalifa, New Paltz, PA (US);

Frantisek Koudelka, Brno, CZ;

Arkady Oksengorn, Boca Raton, FL (US);

Siu Lau, Hampton, NJ (US);

Hardik Patel, Bethlehem, PA (US);

In Y. Choi, Plymouth Meeting, PA (US);

Assignee:

ABB Technology AG, Zurich, CH;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 7/02 (2006.01); H05K 13/00 (2006.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H05K 7/026 (2013.01); H05K 7/1425 (2013.01); H05K 13/0023 (2013.01); Y10T 29/49128 (2015.01);
Abstract

A method and apparatus provides an Intelligent Electronic Device (IED) with new hardware modules. Hardware modules are provided that are configured for electrically connecting with connections of a first IED housing that has a first form factor. A second IED housing is provided having a second form factor that is different from the first form factor. The hardware modules are mounted in the second housing. Adaptor structure is employed to electrically connect the hardware modules with connections of the second housing. The second housing is mounted into an existing wiring and second form factor environment.


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