The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2016

Filed:

Jul. 20, 2009
Applicants:

Tomoko Monda, Yokohama, JP;

Minoru Mukai, Shinagawa-ku, JP;

Kenji Hirohata, Koto-ku, JP;

Inventors:

Tomoko Monda, Yokohama, JP;

Minoru Mukai, Shinagawa-ku, JP;

Kenji Hirohata, Koto-ku, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/02 (2006.01); H05K 3/34 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3436 (2013.01); H05K 1/0268 (2013.01); H05K 2201/10204 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/10545 (2013.01); H05K 2203/163 (2013.01); Y02P 70/613 (2015.11);
Abstract

A damage index predicting system is for predicting a damage-related index of solder joints of an electronic device having the solder joints that electrically connect an electronic component to a mounting circuit board and one or more detection solder joints that are designed so as to have a shorter life than the solder joints. The system includes: a database configured to store a fracture relationship between the detection solder joints and the solder joints; a fracture detector configured to detect fracture of the detection solder joints; and a processor configured to calculate a prediction value of the damage-related index of the solder joints based on information relating to the fracture of the detection solder joints obtained by the fracture detector and the fracture relationship stored in the database.


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