The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2016

Filed:

Oct. 24, 2013
Applicant:

Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;

Inventors:

Terukazu Ihara, Ibaraki, JP;

Jun Ishii, Ibaraki, JP;

Naohiro Terada, Ibaraki, JP;

Assignee:

NITTO DENKO CORPORATION, Ibaraki-Shi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 3/10 (2006.01); G11B 5/48 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 1/05 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
H05K 3/10 (2013.01); G11B 5/486 (2013.01); H05K 1/025 (2013.01); H05K 3/0097 (2013.01); H05K 3/4685 (2013.01); H05K 1/0228 (2013.01); H05K 1/0245 (2013.01); H05K 1/0265 (2013.01); H05K 1/056 (2013.01); H05K 3/06 (2013.01); H05K 2201/0979 (2013.01); H05K 2201/09236 (2013.01); H05K 2201/09254 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/09554 (2013.01); H05K 2201/09627 (2013.01); H05K 2203/0323 (2013.01); Y10T 29/49155 (2015.01);
Abstract

A plurality of suspension boards and an inspection substrate are integrally supported by a support frame. In each suspension board, a line is formed on a conductive first support substrate via a first insulating layer. The first support substrate and the line are electrically connected by a first via in the first insulating layer. In the inspection substrate, a conductor layer is formed on a conductive second support substrate with a second insulating layer sandwiched therebetween. The second support substrate and the conductor layer are electrically connected by a second via in the second insulating layer. The first via and the second via have the same configuration.


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