The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2016

Filed:

Aug. 21, 2014
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Noriyuki Kurita, Oita, JP;

Keiichi Sasaki, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/165 (2006.01); H05K 1/02 (2006.01); B41J 2/14 (2006.01); B41J 2/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0272 (2013.01); B41J 2/14072 (2013.01); B41J 2/14129 (2013.01); B41J 2/1603 (2013.01); B41J 2/1628 (2013.01); B41J 2/1629 (2013.01); H05K 1/0212 (2013.01);
Abstract

A method of manufacturing a print element substrate, comprising preparing a substrate, including a first region and a second region, in which a printing portion is formed on the first region, and a wiring pattern connected to the printing portion is formed on the first region and the second region, forming an insulating film covering the printing portion and the wiring pattern, and forming a conductive cavitation-resistant film on the insulating film, wherein in the forming the insulating film, the insulating film is formed such that a side surface of a portion of the insulating film, which is formed on the second region, includes an inclined face.


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