The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2016
Filed:
Nov. 21, 2014
Mitsubishi Electric Corporation, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A sub-mount includes a sub-mount substrate, an Au layer placed above the sub-mount substrate, a barrier layer which is placed on the Au layer and has a barrier portion at least in a portion of its outer peripheral portion which is other than a portion corresponding to a side of an output end of a semiconductor laser, and a solder layer placed on the barrier layer in an area surrounded by the barrier portion, wherein the semiconductor laser is bonded to the sub-mount through the solder layer, in a state where the semiconductor laser is spaced apart by a predetermined interval from an inner surface of the barrier portion, and further, the output end protrudes, in a direction of output of the laser light, from an end of the solder layer which corresponds to the side of the output end of the semiconductor laser.