The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2016

Filed:

May. 27, 2014
Applicant:

Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;

Inventors:

Naoko Yoshida, Ibaraki, JP;

Kazuhiro Fuke, Ibaraki, JP;

Hidenori Onishi, Ibaraki, JP;

Ryusuke Naito, Ibaraki, JP;

Yuichi Fukamichi, Ibaraki, JP;

Assignee:

NITTO DENKO CORPORATION, Ibaraki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/56 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01); C08K 5/09 (2006.01); C08K 3/00 (2006.01); C08K 3/22 (2006.01); H01L 31/02 (2006.01); H01L 31/0203 (2014.01); H01L 31/0232 (2014.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); C08K 3/0033 (2013.01); C08K 3/22 (2013.01); C08K 5/09 (2013.01); H01L 24/97 (2013.01); H01L 31/02002 (2013.01); H01L 31/0203 (2013.01); H01L 31/02327 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); C08K 2003/2244 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01);
Abstract

An optical semiconductor device includes a metal lead frame including first and second plate portions, an optical semiconductor element mounted on the metal lead frame, and a reflector provided around the optical semiconductor element. A material for the reflector is an epoxy resin composition containing: (A) an epoxy resin; (B) a curing agent; (C) a white pigment; (D) an inorganic filler; and (E) at least one of a carboxylic acid and water. Components (C) and (D) are present in a total proportion of 69 to 94 wt % based on the amount of the overall epoxy resin composition, and the component (E) is present in a proportion of 4 to 23 mol % based on the total amount of the components (B) and (E). The resin composition has a higher glass transition temperature, and is excellent in moldability and blocking resistance and substantially free from warpage.


Find Patent Forward Citations

Loading…