The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2016
Filed:
May. 05, 2014
Applicant:
Himax Technologies Limited, Tainan, TW;
Inventor:
Chiu-Shun Lin, Tainan, TW;
Assignee:
HIMAX TECHNOLOGIES LIMITED, Tainan, TW;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/43 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 29/43 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/03614 (2013.01); H01L 2224/03912 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05009 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/05027 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/05582 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/1181 (2013.01); H01L 2224/11825 (2013.01); H01L 2224/11848 (2013.01); H01L 2224/13006 (2013.01); H01L 2224/1357 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13164 (2013.01); H01L 2224/13552 (2013.01); H01L 2224/13562 (2013.01); H01L 2224/13582 (2013.01); H01L 2224/13611 (2013.01); H01L 2224/13644 (2013.01); H01L 2224/13655 (2013.01); H01L 2224/13664 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/15788 (2013.01);
Abstract
A metal bump structure for use in a driver IC includes a passivation layer disposed on a metal pad and defining a recess on the metal pad, an adhesion layer in said recess, on the metal pad and on the passivation layer, a metal bump disposed in the recess and completely covering the adhesion layer, and a capping layer disposed on the metal bump and completely covering the metal bump so that the metal bump is not exposed to an ambient atmosphere.