The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2016

Filed:

Aug. 06, 2012
Applicant:

Matthias Lehr, Dresden, DE;

Inventor:

Matthias Lehr, Dresden, DE;

Assignee:

GLOBALFOUNDRIES, INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/8242 (2006.01); H01L 49/02 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 28/75 (2013.01); H01L 23/5223 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Integrated circuits with metal-insulator-metal (MIM) capacitors and methods for fabricating such integrated circuits are provided. In an embodiment, an integrated circuit includes a dielectric material layer overlying a semiconductor substrate. A surface conditioning layer overlies the dielectric material layer. Further, a metal layer is formed directly on the surface conditioning layer. A MIM capacitor is positioned on the metal layer. The MIM capacitor includes a first conductive layer formed directly on the metal layer with a smooth upper surface, an insulator layer formed directly on the smooth upper surface of the first conductive layer, and a second conductive layer formed directly on the insulator layer with a smooth lower surface.


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