The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2016
Filed:
Sep. 13, 2013
Applicant:
Tohoku University, Sendai-shi, Myagi, JP;
Inventors:
Assignee:
TOHOKU UNIVERSITY, Sendai-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 25/065 (2006.01); H01L 23/32 (2006.01); H01L 21/52 (2006.01); H01L 23/498 (2006.01); H01L 23/544 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 25/00 (2006.01); B23K 20/00 (2006.01); B23K 20/02 (2006.01); B23K 20/16 (2006.01); H01L 23/31 (2006.01); H01L 23/14 (2006.01); H01L 23/50 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); B23K 20/002 (2013.01); B23K 20/023 (2013.01); B23K 20/16 (2013.01); H01L 21/52 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/32 (2013.01); H01L 23/49838 (2013.01); H01L 23/544 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 24/95 (2013.01); H01L 25/0652 (2013.01); H01L 25/50 (2013.01); H01L 21/76898 (2013.01); H01L 23/147 (2013.01); H01L 23/3121 (2013.01); H01L 23/49827 (2013.01); H01L 23/49894 (2013.01); H01L 23/50 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/27 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/1145 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73104 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/75251 (2013.01); H01L 2224/75611 (2013.01); H01L 2224/75701 (2013.01); H01L 2224/75723 (2013.01); H01L 2224/75745 (2013.01); H01L 2224/75753 (2013.01); H01L 2224/75901 (2013.01); H01L 2224/81002 (2013.01); H01L 2224/8138 (2013.01); H01L 2224/81121 (2013.01); H01L 2224/81143 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81395 (2013.01); H01L 2224/81904 (2013.01); H01L 2224/81907 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/9202 (2013.01); H01L 2224/95145 (2013.01); H01L 2224/95146 (2013.01); H01L 2224/96 (2013.01); H01L 2224/97 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06593 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15311 (2013.01);
Abstract
The present invention relates to a chip support substrate including a lyophilic regionthat is formed on the substrate and that absorbs a chipA, and an electrodethat is formed on the substrate and in the lyophilic region and that generates electrostatic force in the chip, and to a chip support method including the steps of arranging the chip onto the lyophilic region of the chip support substrate with a liquid, the chip support substrate comprising the lyophilic region that is formed on the substrate, and the electrode that is formed on the substrate and in the lyophilic region, and generating the electrostatic force in the chip corresponding to the electrode by applying a voltage to the electrode.