The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2016

Filed:

Jan. 29, 2016
Applicant:

Henkel Ip & Holding Gmbh, Duesseldorf, DE;

Inventors:

Pukun Zhu, Irvine, CA (US);

Gina V. Hoang, Garden Grove, CA (US);

Shashi K. Gupta, Tustin, CA (US);

Andrew Laib, Fullerton, CA (US);

Assignee:

Henkel IP & Holding GmbH, Duesseldorf, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/00 (2006.01); C09J 163/10 (2006.01); C08L 63/10 (2006.01); H01B 1/22 (2006.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); C08L 63/10 (2013.01); C09J 163/10 (2013.01); H01B 1/22 (2013.01); H01L 24/27 (2013.01); H01L 2224/2741 (2013.01); H01L 2224/27848 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/29313 (2013.01); H01L 2224/29324 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29357 (2013.01); H01L 2224/29364 (2013.01); H01L 2224/29369 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/29388 (2013.01); H01L 2224/29393 (2013.01); H01L 2224/29439 (2013.01); H01L 2224/29455 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/0544 (2013.01); H01L 2924/0549 (2013.01); H01L 2924/06 (2013.01); H01L 2924/069 (2013.01); H01L 2924/0635 (2013.01); H01L 2924/0645 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/0695 (2013.01); H01L 2924/0715 (2013.01); H01L 2924/2064 (2013.01); H01L 2924/20103 (2013.01); H01L 2924/20105 (2013.01); H01L 2924/20106 (2013.01); H01L 2924/3511 (2013.01);
Abstract

Provided herein are conductive die attach films having advantageous properties for use in a variety of applications, e.g., for the preparation of large die semiconductor packages. Also provided are formulations useful for the preparation of such films, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In additional aspects, the invention further relates to articles comprising such conductive die attach films adhered to a suitable substrate therefor.


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