The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2016
Filed:
Jan. 05, 2016
Applicant:
Osram Opto Semiconductors Gmbh, Regensburg, DE;
Inventors:
Guido Weiss, Regensburg, DE;
Albert Perchtaler, Finning, DE;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/304 (2006.01); B23K 26/38 (2014.01); B23K 26/40 (2014.01); H01L 21/683 (2006.01); H01L 33/00 (2010.01); H01L 33/38 (2010.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); B23K 26/38 (2013.01); B23K 26/40 (2013.01); H01L 21/3043 (2013.01); H01L 21/6835 (2013.01); B23K 26/364 (2015.10); B23K 2203/172 (2015.10); B23K 2203/50 (2015.10); H01L 33/0095 (2013.01); H01L 33/382 (2013.01); H01L 2221/68327 (2013.01);
Abstract
A method of severing a semiconductor device composite includes a carrier having a main surface and a semiconductor layer sequence arranged on the main surface including forming a separating trench in the semiconductor device composite by a first laser cut such that the separating trench only partially severs the semiconductor device composite in a vertical direction running perpendicular to the main surface, and severing the semiconductor device composite completely along the separating trench with a severing cut with a laser.