The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2016

Filed:

May. 27, 2014
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Hefei Boe Optoelectronics Technology Co., Ltd., Hefei, Anhui, CN;

Inventors:

Min Zhang, Beijing, CN;

Minsu Kim, Beijing, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1343 (2006.01); G02F 1/1362 (2006.01); H01L 27/12 (2006.01); H01L 29/786 (2006.01); G02F 1/1368 (2006.01); H01L 21/77 (2006.01);
U.S. Cl.
CPC ...
G02F 1/134309 (2013.01); G02F 1/1343 (2013.01); G02F 1/1362 (2013.01); G02F 1/1368 (2013.01); G02F 1/136227 (2013.01); G02F 1/136286 (2013.01); H01L 21/77 (2013.01); H01L 27/124 (2013.01); H01L 29/786 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An electrode structure comprises an introduction electrode and a body electrode, and a first isolating layer and a second isolating layer arranged between the introduction electrode and the body electrode. A first via hole is formed in the first isolating layer, a second via hole is formed in the second isolating layer. The hole axes of the first via hole and the second via hole are on the same straight line passing through the body electrode, so that a part of the body electrode is exposed via the first and the second via holes. The introduction electrode is electrically connected with the body electrode through the part of the body electrode. The diameter of the first via hole is smaller than that of the second via hole, and the first isolating layer extends to completely cover the hole wall of the second via hole.


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