The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2016
Filed:
Jul. 11, 2012
Applicants:
Kenji Suzuki, Tokyo, JP;
Hideto Imajo, Tokyo, JP;
Daigo Takagi, Tokyo, JP;
Inventors:
Assignee:
Asahi Kasei Microdevices Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 15/14 (2006.01); G01R 15/20 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G01R 15/146 (2013.01); G01R 15/20 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 24/73 (2013.01); H01L 24/05 (2013.01); H01L 24/48 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73221 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/181 (2013.01);
Abstract
It is intended to reduce manufacturing cost in a current sensor including a primary conductor having a U-shaped current path. A current sensor includes a primary conductor having a U-shaped current path, a support portion for supporting a magneto-electric conversion element, and a lead terminal connected to the support portion, and wherein the current path is not overlapped with the support portion in a plan view, while being formed so as to have a height different from that of the support portion in a side view.