The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2016

Filed:

Oct. 24, 2013
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventor:

Kogo Endo, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01H 11/08 (2006.01); G01H 1/00 (2006.01); A61B 8/00 (2006.01);
U.S. Cl.
CPC ...
G01H 11/08 (2013.01); A61B 8/4483 (2013.01); A61B 8/4494 (2013.01); A61B 8/4411 (2013.01); A61B 8/4488 (2013.01);
Abstract

An ultrasonic measurement device includes an ultrasonic transducer device, a flexible substrate and an integrated circuit device. The ultrasonic transducer device has a substrate, an ultrasonic element array, a plurality of signal electrode lines formed on the substrate and electrically connected to the ultrasonic element array, and a plurality of signal terminals arranged on the substrate. In the flexible substrate, a plurality of signal lines are formed along a first direction. Each of the signal electrode lines has an electrode layer in which at least one signal electrode among some of the ultrasonic elements extends on the substrate. A long side direction of the integrated circuit device extends along a second direction which intersects with the first direction, and each of terminals of the integrated circuit device is connected to a corresponding one of the signal lines of the flexible substrate.


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