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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9448014 B1

PDFFull Text
Date of Patent:
Sep. 20, 2016

Filed:

Oct. 29, 2012

Channel member, and heat exchanger, semiconductor unit, and semiconductor manufacturing apparatus including the same

Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventors:

Kenji Tsubokawa, Satsumasendai, JP;

Kazuhiko Fujio, Satsumasendai, JP;

Kenjiro Maeda, Satsumasendai, JP;

Hiroyuki Abe, Satsumasendai, JP;

Assignee:

KYOCERA CORPORATION, Kyoto-shi, Kyoto, JP;

Attorney:
Primary Examiner:

Marcos D Pizarro

Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/473 (2006.01); F28F 3/12 (2006.01); H01L 21/67 (2006.01); H01L 21/48 (2006.01); F28F 13/12 (2006.01); F28F 21/04 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
F28F 3/12 (2013.01); F28F 13/12 (2013.01); F28F 21/04 (2013.01); H01J 37/32715 (2013.01); H01J 37/32724 (2013.01); H01L 21/4882 (2013.01); H01L 21/67109 (2013.01); H01L 23/367 (2013.01); H01L 23/473 (2013.01); H01L 23/3731 (2013.01); H01L 23/3735 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Channel memberstoaccording to the present invention have an inner spiral channelthrough which a fluidflows. The channelis formed by a lid part, a bottom plate part, and a wall partconnected to the lid partand the bottom plate part. The wall partis made of a ceramic laminate. Even if the wall partof the channel memberstois narrow between channel segments, its good corrosion resistance allows the channelto be resistant to collapse when the fluidis supplied at high pressure. A heat exchanger, a semiconductor unit, and a semiconductor manufacturing apparatusincluding any of the channel memberstohave improved heat exchange efficiency between the channel memberstoand the fluid

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