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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9448012 B1

PDFFull Text
Date of Patent:
Sep. 20, 2016

Filed:

Aug. 30, 2011

Making method for cooling body, cooling body and lighting device comprising the cooling body

Applicants:

Xiaomian Chen, Guangdong, CN;

Xi Huang, Guangdong, CN;

Hao LI, Guangdong, CN;

Shang Ping Xiao, Guangdong, CN;

Inventors:

Xiaomian Chen, Guangdong, CN;

Xi Huang, Guangdong, CN;

Hao Li, Guangdong, CN;

Shang Ping Xiao, Guangdong, CN;

Assignee:

OSRAM GMBH, Munich, DE;

Attorney:
Primary Examiner:

Allen Flanigan

Assistant Examiner:

For K Ling

Int. Cl.
CPC ...
F21V 29/74 (2015.01); F21V 29/76 (2015.01); F28F 1/40 (2006.01); B23P 15/26 (2006.01); H01L 21/48 (2006.01); F21V 29/77 (2015.01); F21V 29/85 (2015.01); F21V 29/89 (2015.01); F21Y 101/02 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
F28F 1/40 (2013.01); B23P 15/26 (2013.01); F21V 29/773 (2015.01); F21V 29/86 (2015.01); F21V 29/89 (2015.01); H01L 21/4882 (2013.01); F21Y 2101/02 (2013.01); H01L 23/3672 (2013.01); H01L 23/3677 (2013.01); H01L 23/3731 (2013.01); H01L 2924/0002 (2013.01); Y10T 29/4935 (2015.01);
Abstract

A method for making a cooling body for a lighting device may include: a) Providing multiple aluminum nitride ceramic radiators; b) Putting the multiple aluminum nitride ceramic radiators into a mold; c) Closing the mold, and injecting a melting metal into the mold so that the metal encloses a portion of each of the aluminum nitride ceramic radiators, wherein the metal has a melting point lower than that of the aluminum nitride ceramic radiators; and d) Opening the mold, and obtaining the cooling body.

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