The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2016
Filed:
Jun. 16, 2014
Applicant:
Samsung Display Co., Ltd., Yongin, Gyeonggi-Do, KR;
Inventors:
Jae Sul An, Hwaseong-si, KR;
Seok Hyun Nam, Seoul, KR;
Sang Hyuck Yoon, Seoul, KR;
Yeong Bae Lee, Suwon-si, KR;
Assignee:
Samsung Display Co., Ltd., , KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); F21K 99/00 (2016.01); H01L 33/44 (2010.01); H01L 33/50 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
F21K 9/56 (2013.01); F21K 9/90 (2013.01); H01L 33/44 (2013.01); H01L 33/507 (2013.01); H01L 33/502 (2013.01); H01L 33/644 (2013.01);
Abstract
A light-emitting diode (LED) package and a method of manufacturing the same are provided. The LED package includes a package mold, an LED chip located on a surface of the package mold, and a wavelength converter located on the surface of the package mold and separated from the LED chip. The wavelength converter includes a first barrier layer located on the surface of the package mold, a wavelength conversion layer located on the first barrier layer, and a second barrier layer located on the wavelength conversion layer.