The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2016

Filed:

Feb. 25, 2015
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Kyouhei Arayama, Shizuoka, JP;

Hiroaki Idei, Shizuoka, JP;

Makoto Kubota, Shizuoka, JP;

Hideki Takakuwa, Shizuoka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08F 2/46 (2006.01); C08F 2/50 (2006.01); C08G 61/04 (2006.01); C08L 33/02 (2006.01); C08F 2/44 (2006.01); C09D 4/00 (2006.01); C09D 5/02 (2006.01); C08G 59/18 (2006.01); C09D 7/12 (2006.01); C08G 65/18 (2006.01); C09D 201/02 (2006.01); C09D 201/08 (2006.01); C08L 101/02 (2006.01); G02B 1/04 (2006.01); G03F 7/00 (2006.01); G03F 7/004 (2006.01); G03F 7/027 (2006.01); G03F 7/029 (2006.01); G03F 7/031 (2006.01); G03F 7/038 (2006.01); C08K 9/04 (2006.01); C08L 33/00 (2006.01); C08L 101/08 (2006.01); C08K 3/22 (2006.01); C09D 133/06 (2006.01);
U.S. Cl.
CPC ...
C08L 33/02 (2013.01); C08F 2/44 (2013.01); C08G 59/18 (2013.01); C08G 65/18 (2013.01); C08K 9/04 (2013.01); C08L 33/00 (2013.01); C08L 101/02 (2013.01); C08L 101/08 (2013.01); C09D 4/00 (2013.01); C09D 5/028 (2013.01); C09D 7/1266 (2013.01); C09D 201/02 (2013.01); C09D 201/08 (2013.01); G02B 1/04 (2013.01); G03F 7/0007 (2013.01); G03F 7/0047 (2013.01); G03F 7/027 (2013.01); G03F 7/029 (2013.01); G03F 7/031 (2013.01); G03F 7/038 (2013.01); C08K 3/22 (2013.01); C09D 133/06 (2013.01);
Abstract

There is provided a dispersion composition containing (A) a metal oxide particle having a primary particle diameter of 1 nm to 100 nm, (B) a polymer compound represented by the specific formula having a weight average molecular weight of 5,000 to 8,000 and an acid value of 70 to 90 mgKOH/g, and (C) a solvent, and a curable composition containing the dispersion composition and (D) a polymerizable compound.


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