The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2016
Filed:
Jun. 05, 2013
Applicant:
Johnson Controls Technology Llc, Wilmington, DE (US);
Inventors:
Sung-Jin Cho, Milwaukee, WI (US);
Frederic C. Bonhomme, Thiensville, WI (US);
Assignee:
Johnson Controls Technology Company, Holland, MI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/88 (2006.01); C01D 15/02 (2006.01); H01M 4/131 (2010.01); H01M 4/1391 (2010.01); H01M 4/36 (2006.01); H01M 4/485 (2010.01); B60L 11/12 (2006.01); B60L 11/14 (2006.01); B60L 11/18 (2006.01); H01M 4/04 (2006.01); H01M 4/505 (2010.01); H01M 4/525 (2010.01); H01M 4/02 (2006.01);
U.S. Cl.
CPC ...
C01D 15/02 (2013.01); B60L 11/123 (2013.01); B60L 11/14 (2013.01); B60L 11/1875 (2013.01); B60L 11/1877 (2013.01); B60L 11/1879 (2013.01); H01M 4/131 (2013.01); H01M 4/1391 (2013.01); H01M 4/364 (2013.01); H01M 4/485 (2013.01); B60L 2240/545 (2013.01); H01M 4/043 (2013.01); H01M 4/0404 (2013.01); H01M 4/0409 (2013.01); H01M 4/505 (2013.01); H01M 4/525 (2013.01); H01M 2004/021 (2013.01); Y02E 60/122 (2013.01); Y02P 70/54 (2015.11); Y02T 10/6217 (2013.01); Y02T 10/705 (2013.01); Y02T 10/7005 (2013.01); Y02T 10/7011 (2013.01); Y02T 10/7077 (2013.01); Y10T 29/4911 (2015.01);
Abstract
A material includes a first lithium metal oxide (LMO) component formed using a spray-dry technique and a second LMO component formed using a co-precipitation technique. In particular, the LMO components may include lithium nickel manganese cobalt oxide (NMC). The material may further include a binder and a conductive component.