The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2016

Filed:

Apr. 23, 2015
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Georg Ernst, Thalmassing, DE;

Horst Theuss, Wenzenbach, DE;

Assignee:

INFINEON TECHNOLOGIES AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); G01L 19/00 (2006.01); G01L 1/14 (2006.01); G01L 1/16 (2006.01);
U.S. Cl.
CPC ...
B81B 7/007 (2013.01); B81B 7/0048 (2013.01); B81C 1/00301 (2013.01); G01L 19/0069 (2013.01); G01L 19/0084 (2013.01); H01L 23/49838 (2013.01); B81B 2201/0264 (2013.01); B81B 2207/098 (2013.01); G01L 1/148 (2013.01); G01L 1/16 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01);
Abstract

In various embodiments, a sensor apparatus is provided. The sensor apparatus includes a sensor device having a plurality of electrical contacts; a housing having a plurality of sidewalls; and a metal carrier structure, which extends into the housing in a manner passing through two mutually opposite sidewalls from the plurality of sidewalls. The metal carrier structure is embodied in a resilient fashion at least in the direction of a sidewall through which the metal carrier structure extends. The sensor device having the plurality of electrical contacts is mounted in a resilient fashion on the metal carrier structure and is electrically conductively connected to the metal carrier structure by the plurality of contacts.


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