The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2016

Filed:

Jan. 29, 2014
Applicant:

GM Global Technology Operations Llc, Detroit, MI (US);

Inventors:

Hongguang Sun, Whitby, CA;

Regan P. Dixon, Whitby, CA;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 10/02 (2006.01); H01M 10/36 (2010.01); B60L 11/18 (2006.01); B60L 3/00 (2006.01); H01M 10/65 (2014.01); H01M 10/613 (2014.01); H01M 10/60 (2014.01); H01M 10/625 (2014.01);
U.S. Cl.
CPC ...
B60L 11/1874 (2013.01); B60L 3/0046 (2013.01); B60L 2240/545 (2013.01); H01M 10/60 (2015.04); H01M 10/613 (2015.04); H01M 10/625 (2015.04); H01M 10/65 (2015.04); Y02T 10/7005 (2013.01); Y10S 903/907 (2013.01);
Abstract

A battery pack and method of cooling a battery pack. In one form, the battery pack is an assembly made up of numerous battery cells arranged within numerous modules. Cooling channels that receive cooling fluid from a ducted supply are placed between adjacent cells or cooling plates within each of the modules. The ducted supply includes beads or related area-increasing undulations that are designed to improve both the stiffness of the ducting as well as the uniformity of the flow rates of individual cooling channels within each of the modules. In one form, the pressure-enhancing beads are placed in an inlet portion of the ducting that is adjacent a forward portion of one or more of the sequentially-encountered modules in order to promote a more equitable distribution of the cooling fluid between the various cooling channels within each of the modules.


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